Cliff Engel (´10) of Intel Corporation will present
Adventures to the leading edge of the semiconductor industry
Tuesday, April 9th 12:10 pm in CNS 333
Pizza and Beverages Provided
Beginning with my research at Ithaca College (Class of 2010) on cuprous oxide, my career in materials chemistry has focus on pushing the boundaries of fabrication techniques in nanopatterning. At Northwestern, my research concentrated on designing nanofabrication techniques with potential for scalability and use in a wide range of application. This talk will focus mainly on my work in the development and characterization of an all polymer nano-wrinkle material system. Wrinkles, spontaneous disordered features that are produced in response to compressive force, are an ideal for applications where fine feature control is no longer the main motivation. At Northwestern, we developed a wrinkle material system that could be both tuned in feature size from as small as 30 nm up 10 μm while maximizing the wrinkle amplitude at all wavelengths. By charactering the material properties of both the skin and substrate, we were able to generate wrinkle patterns with fine control over periodicity, amplitude, and orientation. This research experience set the groundwork for my career as a process engineer at Intel’s Portland Technology Development working on the leading edge of nanofabrication techniques in the semiconductor industry.
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